The heat of the LED in the LED fill light cannot be dissipated by radiation alone, so it is the "cold" light source of the LED. At present, 80-90% of the energy of LED is converted into heat energy. If the heat of LED chip can not be dissipated, it will accelerate the aging of chip, and may also lead to the melting of solder joints, making the chip invalid.
So the temperature of the chip can't exceed 125 ℃. Obviously, in order to effectively reduce the temperature of the chip, it is necessary to reduce the thermal resistance as much as possible. Because this ensures the life of the LED light source in the LED fill light, heat dissipation has become a key factor in the application of high-power LED. Improve the quantum efficiency of LED, increase the luminous efficiency of the chip, and fundamentally reduce the heat generation. In addition, by improving the packaging structure of LED, the heat can be more easily dissipated. The structure of flip chip welding is used for heat dissipation. The core piece is adhered to the square thermite lining with a very thin heat conducting adhesive, which is more conducive to heat transfer.